Phone Tin Reballing Stencil Accurate Positioning CPU Tin Planting Template for Samsung S9 Series

Feature: 1. SUITABLE MODELS: The CPU tin reballing stencil is suitable for Samsung S9 and S9+ series, for Qualcomm Snapdragon 845 and for Exynos 9810 CPU. 2. FAST TINNING SPEED: Our reballing stencil will not change under high temperature, and the tinning speed is fast, which can improve the efficiency of tinning. 3. MULTIPLE IC RECESSES: Tin reballing stencil has multiple IC recesses on the main body of the stencil with half engraving process to effectively preventing small ICs from sticking to tin and protecting small ICs from breaking corners. 4. PRECISE POSITIONING: The tin planting stencil can be precisely positioned and has a compact appearance for use in different applications. 5. EASY TO USE: CPU tinning stencil is very portable, can be used as you go, easy to use, is a good maintenance and DIY tools. Specification: Item Type: Phone Tin Reballing Stencil Material: Stainless steel Pitch: Approx. 0.12mm 0.005in Applicable CPU: For Qualcomm Snapdragon 845 and for Exynos 9810 CPU Applicable Model: For Samsung S9 and for S9+ series. Package List: 1 x Phone Tin Reballing StencilSUITABLE MODELS: The CPU tin reballing stencil is suitable for Samsung S9 and S9+ series, for Qualcomm Snapdragon 845 and for Exynos 9810 CPU. FAST TINNING SPEED: Our reballing stencil will not change under high temperature, and the tinning speed is fast, which can improve the efficiency of tinning. MULTIPLE IC RECESSES: Tin reballing stencil has multiple IC recesses on the main body of the stencil with half engraving process to effectively preventing small ICs from sticking to tin and protecting small ICs from breaking corners. PRECISE POSITIONING: The tin planting stencil can be precisely positioned and has a compact appearance for use in different applications. EASY TO USE: CPU tinning stencil is very portable, can be used as you go, easy to use, is a good maintenance and DIY tools.